The global electrostatic discharge (ESD) stackable boxes market is estimated to showcase growth at a robust CAGR of around 7% to 8% during the forecast period 2022-2032. Increasing demand for ideal electrostatic discharge packaging solutions across diverse sectors for shielding products from charge disruption and electric charge is expected to create high revenue generation opportunities in the global ESD stackable boxes market through 2032.
Electrostatic sensitive instruments have emerged as an effective tool for declining static current generated by packaging materials due to friction and other factors during transit. ESD stackable boxes are primarily used for the storage and packaging of electronic components such as semiconductors and printed circuit boards (PCBs).
Static could be created by various factors such as contact with different devices, weather, and friction among others. Thus, to protect the repacked electronic components and prevent the accumulation of electrostatic charges in the packaging, innovative electrostatic discharge packaging solutions are being used. These packaging solutions are made by the victimization of special materials and additives which makes the package electrically conductive and adds properties such as charge dissipation, resistance to antistatic charging, and electric charge shielding.
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Attributed to this, ESD stackable boxes are gaining huge popularity across the sectors such as semiconductors, electrochemical, electronics, automotive, and mining among others. Hence, key manufacturers in the market are aiming at research and development activities for introducing novel products. Some of the players are also aiming at providing customization ESD packaging solutions as per the end use and application requirement. This is projected to bolster the growth in the global ESD stackable boxes over the coming years.
Which are Some Prominent Drivers Spearheading ESD Stackable Boxes Market Growth?
ESD stackable boxes do not bend or sag under heavy loads and possess superior physical properties as compared to thermoplastics and corrugated boxes. These boxes are resistant to solvents, greases, dust, cutting oils, and mild acids of pH levels between 3 and 10. They also have strong carbon-infused walls inside, which assist in ensuring optimum space utilization while assembling operations.
On account of these attributes, ESD stackable boxes are finding a wide range of usage across diverse industries for packaging and storing applications of printed circuit boards, medicines, medical components, explosive powders, electronic components, and others. This is estimated to facilitate the demand for ESD stackable boxes in the global market.
The trend of electrification and miniaturization is creating deeper inroads across consumer electronics, automotive, medical devices, and others along with industrial automation. This has resulted in accelerating the sales of electronic components such as semiconductors, printed circuit boards, and others.
As ESD stackable boxes are extensively used for packaging these electronic components, owing to their resistance to antistatic charging and charge dissipation, increasing sales of semiconductors and printed circuit boards are anticipated to fuel the demand in the global market.
What are the Challenges Faced by the ESD Stackable Boxes Market?
The cost of electrostatic discharge packaging solutions such as ESD boxes is relatively higher in comparison to other packaging solutions. Irrespective of the higher price of ESD stackable boxes, they are bulky in nature, making them difficult to handle. This, in addition to lack of availability in small sizes and presence of low-cost substitutes such as anti-static bags in the market, is hindering the sales of ESD stackable boxes.
Also, implementation of numerous stick regulations and standards regarding the use of plastics such as polystyrene, high-density polyethylene, polypropylene, polyethylene terephthalate, polyvinyl chloride, and others for packaging products is projected to restrain the market growth.
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Why is Asia Pacific Excluding Japan Emerging as an Opportunistic ESD Stackable Boxes Market?
Future Market Insights states that Asia Pacific excluding Japan is estimated to account for a dominant share in the global ESD stackable boxes market between 2022 and 2032.
Due to the rising concerns regarding environmental sustainability, increasing fuel prices, and the launch of favorable government policies, a swift rise in sales of electric vehicles is being witnessed across Asia Pacific, creating strong demand for electrostatic discharge packaging solutions.
For instance, according to a study by the India Brand Equity Foundation, the sales of electric two-wheels in India more than double to 233,971 units in 2021, in comparison to 100,736 units in 2020. As ESD stackable boxes are used in packaging electronic circuits and automotive components, this rise in sales of electric vehicles is anticipated to bolster the demand in the Asia Pacific excluding Japan market.
How is North America Contributing to the Growth of the ESD Stackable Boxes Market?
As per FMI, North America is projected to emerge as a highly remunerative market for ESD stackable boxes during the forecast period 2022-2032.
With increasing adoption of innovative technologies and advanced consumer electronics across North America, owing to the large presence of tech-savvy population, sales of electronic products and components are rapidly increasing, fueling the demand for ESD stackable boxes.
Hence, key players in the market are increasingly aiming at launching novel products to cater to this growing demand. For instance, RTP Company, a U.S.-based plastic fabrication company announced expanding its product portfolio by adding new ESD stackable boxes in 5 to 7 inches sizes. A multiplicity of such new products launches is expected to augment the sales in the North America market.
Market Competition
Some of the leading players in the ESD stackable boxes market are Conductive Containers, Inc., Genesis Plastics Technologies, Inc., RTP Company, Tandem Equipment Sales, Inc., Molded Fiber Glass Company, Induspac Inc., Esdwork Co Ltd., Toolcraft Plastics, Dipaul Group, and others.
Prominent players are aiming at launching novel products and merger & acquisition to increasing their share in the highly competitive market.
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Key Segments Profiled in the ESD Stackable Boxes Market Survey
By Material Type:
- Polymers
- Polystyrene
- High density Polyethylene (HDPE)
- Polypropylene (PP)
- Polyethylene Terephthalate (PET)
- Polyvinyl Chloride (PVC)
- Others (SAN, ABS)
- Carbon Black
- Ethylene Bis Stearamide
- Lauric Diethanolamide
- Other Additives
By End Use:
- Electrical & Electronics Packaging
- Printed Circuits Boards (PCB)
- Semi-Conductors
- Automotive Components
- Explosive Powders
- Drugs & Medicines
- Medical Components
- Others
By Region:
- North America
- Latin America
- Western Europe
- Eastern Europe
- Asia Pacific excluding Japan
- Japan
- Middle East and Africa
About Future Market Insights (FMI)
Future Market Insights (ESOMAR certified market research organization and a member of Greater New York Chamber of Commerce) provides in-depth insights into governing factors elevating the demand in the market. It discloses opportunities that will favor the market growth in various segments on the basis of Source, Application, Sales Channel and End Use over the next 10-years.
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