The global semiconductor packaging market is expected to reach US $ 26.9 billion by 2022. Sales are expected to increase to 6, 5% CAGR during the evaluation period, with the market valuation reaching $ 50.6 billion by 2032.
Semiconductor packaging is widely used in electronic devices, as they act as a mediator between substances. Semiconductor packaging plays a crucial role in defensive IC chips, as it surrounds the environment and ensures that the chip mounts to the developed wiring boards.
Increasing demand for innovative digital devices such as smartphones, tablets and portable devices will stimulate demand for semiconductor packaging. In addition, the growing integration of semiconductors in autonomous and electric vehicles will continue to drive sales in the automotive sector over the planned period.
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Semiconductor packaging is also widely used in the aerospace and defense industry. It is used for data processing units and aircraft guide control sets in the aerospace industry.
The defense sector uses semiconductor chips for the missile defense system. In addition, advanced fighter jets require a large amount of semiconductor packaging. The aviation industry also uses semiconductors for boarding, control and immigration applications. This is expected to increase semiconductor packaging sales during the forecast period.
“Increasing demand for plastic semiconductor packaging, along with the expansion of the electronics sector into emerging economies will drive market growth over the forecast period.” says an IMF analyst.
Key points:
- Depending on the type of material, sales in the plastic segment will account for 42% of the total market share in 2022.
- As for the end-use industry, the consumer electronics segment will offer an incremental opportunity of about US $ 12.1 billion.
- The US is expected to account for 16% of North America’s semiconductor packaging market share by 2032.
- India’s semiconductor packaging market will offer an incremental opportunity of more than $ 1.7 billion.
Competition landscape
Amkor Technology, ASE Group, Intel Corporation, Samsung Electronics Co., Ltd., Texas Instruments, Fujitsu Limited and Powertech Technology, Inc. are the main players operating in the semiconductor packaging market. Some of the other notable players in the global semiconductor packaging market include Taiwan Semiconductor Manufacturing Company, FlipChip International LLC, HANA Micron Inc., ISI – Interconnect Systems, Veeco Instruments Inc., Signetics, Broadcom Inc. and STMicroelectronics NV are some of the leading players operating in the global semiconductor packaging market. Level 1 key players have around 20-25% of the global semiconductor packaging market.
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Semiconductor packaging market report
Future Market Insights, in its new report, offers an unbiased analysis of the global semiconductor packaging market, analyzing historical demand for 2015-2021 and forecast statistics for 2022-2032. The study reveals market growth projections for semiconductor packaging based on material (plastic, ceramic and metal), technology (grid matrix, small contour packaging, lead-free flat package and dual in-line packaging) and the end-use industry (consumer electronics, automotive, healthcare, computer and telecommunications, aerospace and defense) in seven regions.
Semiconductor packaging market by category
By material:
By technology:
- Grid matrix
- Small scheme packing
- Lead-free flat pack
- Dual line packaging
By end-use industry:
- Consumer electronics
- Automotive
- Health care
- Computers and Telecommunications
Aerospace and Defense
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About the packaging division of Future Market Insights
Future Market Insights ’packaging division offers in-depth historical analysis and projections for the next ten years and covers the competitive landscape through a single view of the control panel. From packaging materials, packaging machinery to packaging designs and formats, Future Market Insights has a comprehensive database for these vertical sectors, offering customers unique research offerings and strategic recommendations. With a repository of more than 1,000 reports, the team has thoroughly analyzed the packaging industry in more than 50 countries. The team evaluates all nodes in the value chain and offers end-to-end research and consulting services; contact us to explore how we can help.
Table of Contents
- Executive summary
1.1. Global market prospects
1.2. Demand trends
1.3. Supply trends
1.4. Analysis of the technological roadmap
1.5. Analysis and recommendations
- Market overview
2.1. Market coverage / Taxonomy
2.2. Market definition / Scope / Limitations
- Market background
3.1. Market dynamics
3.2. Impact of Covid-19
3.3. Macro factors and forecast factors
3.4. Value Chain Analysis
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