Demand for Die Bonder Equipment is projected to reach US$ 4.2 billion in 2022 and to increase to US$ 6.0 billion between 2022 and 2032 at a CAGR of 4%. Growth is being fueled by an increase in the use of stacked die technology in the Internet of Things (IoT) devices. Therefore, die bonder equipment is extensively used in the manufacturing of …
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