Chip-On-Flex Market Worth US$ 2631.5 Million by 2032 | Future Market Insights,Inc.

The chip-on-flex market is anticipated to earn US$ 1800.6 million in 2022 and US$ 2631.5 million from 2022 to 2032, increasing at a CAGR of 3.9%. Flex circuits’ growing range of applications is what is driving growth. The market for biscuit mixes saw a CAGR of 2.6% between 2016 and 2021.

The chip on flex is most frequently utilized in RFID chips, which have a small surface area and require mass production. As technology develops, there is a fundamental need for greater accuracy and flexibility, and the chip-on-flex industry is witnessing increased demand because to its affordability. Single-sided chip on Flex had a bigger market share due to benefits like less wiring.

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Global Chip-on-flex Market: Market Dynamics 

The rising investment in R&D to produce advanced flexible displays in the market is the major factor driving the growth of the market. Also, the advantages produce by chip-on-flex such as heat sinks, component assembly, penalization, shielding, over molding, and graphics overlay among others makes them a critical component in various industries such as the electronic industry, aerospace, defense, and many others.

Also, the rising demand for small and flexible electronics critical to various devices such as displays, sensors, lighting, biomedical implants, and radio frequency identification which require automated manufacture with highly accurate performance is anticipated to result in an exponential growth of the market. With the use of these chips, industries ensure increased accuracy with reduced cost and amplified product quality with testing repeatability.

However, the increased cost of raw materials and changing consumer needs are some of the factors that can restrain the growth of the global Chip-on-flex market.

Single-sided chips on flex accounted for a higher market share in 2016 owing to various advantages like reduced wiring errors, higher circuit density, stronger signal quality, and design flexibility. The other segment can also be expected to witness a significant CAGR during the forecast period.

Market Competition

Some of the key participants present in the global chip-on-flex market include

  • LGIT corporation,
  • Stemko group,
  • Flaxseed,
  • Chipbond technology corporation,
  • CWE, Danbond technology co. ltd.,
  • AKM industrial company ltd.,
  • compass technology company limited,
  • Compunetics and Stars microelectronics public company ltd.
  • among others.

Attributed to the presence of such a high number of participants, the market is highly competitive. While global players such as LGIT Corporation, Stemko Group, Flexceed, and Chipbond technology corporations account for considerable market size, several regional-level players are also operating across key growth regions, particularly in the Asia Pacific.

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Key Segments Profiled in the Chip-On-Flex Industry Survey

Chip-On-Flex Market by Type:

  • Single-sided COD Chip-On-Flex
  • Other Chip-On-Flex Types

Chip-On-Flex Market by Verticals:

  • Chip-On-Flex in Military
  • Chip-On-Flex in Medical
  • Chip-On-Flex in Aerospace
  • Chip-On-Flex in Electronics
  • Chip-On-Flex in Other Verticals

Chip-On-Flex Market by Region:

  • North America Chip-On-Flex Market
  • Latin America Chip-On-Flex Market
  • Europe Chip-On-Flex Market
  • Asia Pacific Chip-On-Flex Market
  • Japan Chip-On-Flex Market
  • Middle East and Africa Chip-On-Flex Market

Table of Content

1. Executive Summary

1.1. Global Market Outlook

1.2. Demand-side Trends

1.3. Supply-side Trends

1.4. Technology Roadmap Analysis

1.5. Analysis and Recommendations

2. Market Overview

2.1. Market Coverage / Taxonomy

2.2. Market Definition / Scope / Limitations

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Future Market Insights, Inc. (ESOMAR certified, Stevie Award – recipient market research organization, and a member of Greater New York Chamber of Commerce) provides in-depth insights into governing factors elevating the demand in the market. It discloses opportunities that will favor the market growth in various segments based on Source, Application, Sales Channel, and End Use over the next 10 years.

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