The global quad-flat-no-lead packaging market is valued at approximately US$ 62 billion and is predicted to exceed US$ 235 billion by the end of the projection year. The global quad-flat-no-lead packaging market is predicted to develop at a high CAGR of 13.1% from 2017 to 2027.
The research report also covers various quad-flat-no-lead packaging alternatives, as well as trends impacting the global market and essential drivers fueling its expansion, as well as difficulties that will negatively affect the market’s revenue growth. The study covers market forecasts for the next six years as well as historical data.
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Global Quad-Flat-No-Lead Packaging Market: Factors Influencing Growth
Factors such as rising demand for wireless applications, growing adoption of portable devices, small form factor, enhanced thermal performance, rising applications in the automobile sector, high electrical performance, and increased reliability are boosting adoption and consequently the growth in revenue of the global quad-flat-no-lead packaging market. However, aspects such as changing the price of raw materials, more space needed by QFN packaging, wire-bond challenge, high competition with WLCSP and BGA, high cost, and problems associated with assembling the QFN package are hindering the growth of the global market.
Global Quad-Flat-No-Lead Packaging Market: Segmental Snapshot
The global quad-flat-no-lead packaging market is segmented on the basis of type, QFN variants, application and by region.
- By type, the plastic molded QFNs segment is expected to reflect high market attractiveness and is the largest segment. The plastic molded QFNs segment is estimated to reach a value higher than US$ 180 Bn by the end of the year forecast thus dominating the global market. Air-cavity QFNs segment is projected to grow at a higher pace in the coming years.
- By the QFN variant, the quad-flat-no-lead segment is anticipated to reach a noteworthy valuation by the end of the assessment period. The ultrathin quad-flat-no-lead segment is projected to grow at the fastest rate to register a CAGR of 14.4% throughout the period of assessment.
- By application, the radio frequency devices segment is estimated to be valued at around US$ 26 Bn in 2017 and is likely to lead the global market. The wearable devices segment is projected to register the fastest growth rate of 0% owing to the increased use of quad-flat-no-lead packaging in wearable devices.
- By region, Asia Pacific excluding Japan reflects high growth potential. The quad-flat-no-lead packaging market in Asia Pacific excluding Japan is projected to grow at the highest rate and is estimated to be the largest among all other regional markets, thus dominating the global market.
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Global Quad-Flat-No-Lead Packaging Market: Forecast Highlights
The global quad-flat-no-lead packaging market is anticipated to reach a value higher than US$ 235 Bn by the end of the year of assessment from a valuation of more than US$ 68 Bn in 2017. The global market for quad-flat-no-lead packaging is projected to grow at a stellar CAGR of 13.1% throughout the period of forecast.
Global Quad-Flat-No-Lead Packaging Market: Competitive Assessment
The research report on the global market for quad-flat-no-lead packaging includes analysis on key players and presents vendor insights in a dedicated chapter. Intelligence on key players such as NXP Semiconductor, Fujitsu Ltd., Toshiba Corporation, Texas Instruments, Microchip Technology Inc., STATS ChipPAC Pte. Ltd., ASE Group, Amkor Technology, UTAC Group, Linear Technology Corporation, Henkel AG & Co., and Broadcom Limited has been included in this chapter.
Market Segmentation
By Type
- Air-Cavity QFNs
- Plastic-moulded QFNs
By QFN Variants
- Very thin quad flat no-lead (VQFN)
- Ultrathin quad flat no-lead (UQFN)
- Quad flat no-lead (QFN)
- Others
By Applications
- Radio Frequency Devices
- Wearable Devices
- Portable Devices
- Others
By Region
- North America
- Latin America
- Western Europe
- Eastern Europe
- APEJ
- Japan
- MEA
Table of Content
1. Executive Summary
1.1. Market Overview
1.2. Market Analysis
1.3. FMI Recommendation
2. Market Introduction
2.1. Market Taxonomy
2.2. Market Definition
2.3. Quad Flat No-Leads Packaging – Solution Overview
3. Market View Point
3.1. Macro-Economic Factors
3.2. Opportunity Analysis
3.3. Patents Overview
4. Global Market Analysis 2012–2016 and Forecast 2017–2027
4.1. Market Size and Y-o-Y Growth
4.2. Absolute $ Opportunity
4.3. Value Chain
4.4. Key Regulation
4.5. Global Trends
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