By 2032, it is expected that the market for die bond equipment will be worth US$ 6.0 billion. This growth is largely attributable to the growing use of stacked-die technology in IoT devices, which will increase demand over the coming years.
Die bonder machinery is therefore frequently used in the production of semiconductor devices. The die is also attached to the substrate using a variety of techniques, including epoxy, eutectic, soft solder, and flip chip.
As a result, the market for die bonder equipment is anticipated to expand at a significant CAGR over the course of the forecast period, providing manufacturers of die boner equipment with lucrative growth opportunities.
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Global Die Bonder Equipment Market: Dynamics
Growing demand for semiconductor integrated circuits is one of the key factors expected to drive the overall demand for die bonder equipment in future. Increasing adoption of electronic systems due to rising number of end-use applications will create healthy demand for integrated circuits (ICs).
This, in turn, is propelling the demand for die bonder equipment in the global market. Additionally, growing adoption of IOTs, ultra-high definition television and hybrid laptops is further expected to create significant demand for die bonder equipment in future. Furthermore, growing demand for polymer adhesive water bonding equipment is further expected to become a barrier to the growth of the die bonder equipment market in future.
Global Die Bonder Equipment Market: Regional Outlook
In the global market of die bounder equipment, Asia Pacific is expected to dominate the market owing to growing demand from the region. This growing demand can primarily be attributed to the presence of a huge number of IC manufacturers in the region. Growing IC demand due to increasing smartphones and tablets production will make the region grow at a healthy pace in future.
Moreover, the market for die bonder equipment in North America and Europe is also projected to grow at a healthy pace owing to increasing demand for semiconductors ICs from the region. The fast adoption of new and latest technologies in the region is also expected to drive the market in the region. Furthermore, MEA and Latin America are also expected to create demand for die bonder equipment in future as the market in these regions is in the growing stage as compared to other regions.
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Global Die Bonder Equipment Market: Market Participants
In the global die bonder equipment market, manufacturers are continuously focused towards automation of the tie bonding technology. Names of some of the manufacturers engaged in the development and manufacturing of die bonder equipment are mentioned:
- Besi
- ASM Pacific Technology Limited (ASMPT)
- Kulicke & Soffa Industries, Inc.
- Tresky AG
- SHIBAURA MECHATRONICS CORPORATION
- West·Bond, Inc.
- Panasonic Corporation
- MRSI Systems
- SHINKAWA LTD.
- Palomar Technologies
- DIAS Automation
- Toray Engineering
- FASFORD TECHNOLOGY
The research report presents a comprehensive assessment of the Die Bonder Equipment market and contains thoughtful insights, facts, historical data, and statistically supported and industry-validated Die Bonder Equipment market data. It also contains projections using a suitable set of assumptions and methodologies. The research report provides analysis and information according to Die Bonder Equipment market segments such as geographies, application, and industry.
Global Die Bonder Equipment Market: Segmentation
The global die bonder equipment market can be segmented on the basis of product type, attachment method, end user and region.
On the basis of product type, the global market is segmented as:
- Manual Die Bonder Equipment
- Semi-Automatic Die Bonder Equipment
- Fully Automatic Die Bonder Equipment
On the basis of attachment method, the global market is segmented as:
- Epoxy Die Bonder
- Eutectic Die Bonder
- Soft Solder Die Bonder
- Flip Chip Die Bonder
On the basis of end user, the global market is segmented as:
- Integrated Device Manufacturers (DMs)
- Outsourced Semiconductor Assembly and Test (OSAT)
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