The North American Non-UV Dicing Tapes Market is poised for significant market growth in the semiconductor industry, driven by a robust ecosystem of research and development, cutting-edge technologies, and high-tech industries. The region hosts a multitude of leading companies and research institutions dedicated to semiconductor innovation, which bodes well for the adoption of non-UV dicing tapes.
Industries like electronics, telecommunications, aerospace, and defense are prevalent in North America and increasingly rely on high-performance semiconductor chips. This dependence fuels the demand for precise and reliable dicing solutions, making non-UV dicing tapes a vital component in the production process.
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As the semiconductor landscape evolves to accommodate emerging technologies like artificial intelligence, machine learning, and IoT, the intricacy of chip designs grows. Non-UV dicing tapes are pivotal in achieving the precision required for these complex designs.
Moreover, North America is at the forefront of advanced packaging techniques like 2.5D/3D packaging and fan-out wafer-level packaging (FOWLP). Non-UV dicing tapes are crucial in preserving wafer integrity during these processes, enhancing chip performance and reliability. With a projected Compound Annual Growth Rate (CAGR) of 5.8% over the forecast period, North America’s semiconductor market is poised for sustained expansion.
The global non-UV dicing tapes market is poised for substantial growth, with a projected value of US$1.59 billion in 2023, set to expand further at a Compound Annual Growth Rate (CAGR) of 6.0% between 2023 and 2033, ultimately reaching approximately US$2.8 billion by 2033. This upward trajectory is attributed to the ongoing trends of miniaturization and the Internet of Things (IoT), which are driving the demand for non-UV dicing tapes.
The advent of 5G technology marks a transformative moment in the world of connectivity, offering unprecedented data speeds, lower latency, and enhanced connectivity across various industries. As the demand for semiconductor chips capable of meeting the processing demands of 5G-compatible devices grows, non-UV dicing tapes play a pivotal role in their production.
5G technology’s high-frequency operation necessitates impeccable signal integrity. Any interference during the dicing process could compromise data transmission and the performance of 5G devices. Non-UV dicing tapes are meticulously designed to ensure precise and clean dicing, preserving the delicate circuitry of 5G chips. This precision is essential for maintaining the signal integrity required for seamless 5G connectivity, making non-UV dicing tapes indispensable in the 5G technology revolution.
Key points:
- Enhanced Yield and Quality: Non-UV dicing tapes offer superior adhesion and stability, minimizing wafer breakage and improving yield rates during the dicing process, ultimately leading to higher-quality chips.
- High-Temperature Resistance: These tapes are designed to withstand the high temperatures generated during dicing, ensuring reliable performance and avoiding tape residue or damage to the wafer surface.
- Minimal Residue and Clean Removal: Non-UV dicing tapes leave minimal residue on the wafer after removal, reducing the need for additional cleaning processes and enhancing overall production efficiency.
- Compatibility with Advanced Materials: The market provides non-UV dicing tapes that are compatible with various advanced semiconductor materials, such as silicon carbide (SiC) and gallium nitride (GaN), meeting the evolving needs of the industry.
- Customization Options: Non-UV dicing tapes can be customized to different wafer sizes and thicknesses, ensuring precise and secure bonding during the dicing process.
- Environmental Considerations: Many non-UV dicing tapes are designed with eco-friendly materials and processes, aligning with the industry’s focus on sustainability and reducing environmental impact.
Market Dynamics:
The demand for non-UV dicing tapes primarily influenced by the increased demand for the semiconductor manufacturing industry. Non-UV dicing tapes are increasingly gaining preference among semiconductor manufacturers due to the easy removal of chips from wafers after the dicing process.
The decrease in size chips or ICS in electronic devices is reduced due to technological advancements. Hence, it is driving the non-UV dicing tapes market among IC manufacturers. The demand for non-UV dicing tapes is expected to be escalated by the increasing electronic durable gadgets during the forecast period.
PET is the most commonly used material for the manufacturing of non-UV dicing tapes, owing to its advantages such as light in weight, stability, good barrier protection, and high-pressure resistance offered by PET material. Non-UV dicing tapes commonly used in wafer dicing applications.
The manufacturers are reducing the thickness of the wafer due to technological advancement and the growing demand for aesthetically thin electronic products. Thus it results in increased demand for non-UV dicing tapes during the forecast period. The increase in demand for electrical and electronic devices is expected to create an opportunity for the manufacturers of non-UV dicing tapes in the coming years.
It is due to an increase in demand for products such as computers and electrical appliances. Thus it has boosted the demand for PCBs and semiconductors. Therefore the market is expected to witness a positive outlook towards non-UV dicing tapes over the forecast period.
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Regional Outlook:
The Asia Pacific region represents remunerative growth opportunities for non-UV dicing tapes market during the forecast period. It is due to the rise in the consumption of compact semiconductors that generate demand for dicing tapes. There is an increased demand for non-UV dicing tapes in developing countries such as India, Brazil, etc.
Established packaging manufacturers are increasingly planning to set-up their manufacturing base in these countries. In addition, emerging economies import electronic components such as semiconductors and PCBs for the production of electronic devices.
Recent Development:
- In March 2017, the company set up QES Technology Phillippines Inc. in Manila. It increases the capacity of the company, and increase the supply of non-UV dicing tapes market in Manila.
Key Players:
Some of the leading players operating in the non-UV dicing tapes market are as follows :
- Pantech Tape Co. Ltd.
- Furukawa Electric Co. Ltd.
- Mitsui Chemicals Inc.
- AI Technology, Inc.
- LINTEC Corporation
- Pantech Tape Co. Ltd
- QES GROUP BERHAD
The report is a compilation of first-hand information, qualitative and quantitative assessment by industry analysts, inputs from industry experts, and industry participants across the value chain. The report provides in-depth analysis of parent market trends, macroeconomic indicators and governing factors along with market attractiveness as per segments. The report also maps the qualitative impact of various market factors on market segments and geographies.
Regional analysis includes
- North America
- Latin America
- Europe
- Middle East and Africa (MEA)
- East Asia
- South Asia
- Oceania
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Market Segmentation:
By Material Type:
- PVC
- PET
- PO
- Others (EVA, etc.)
By Thickness:
- 85-125 Micron
- 126-150 Micron
- Below 85 Micron
- Above 150 Micron
By Coating Type:
- Single Sided
- Double Sided
By Application:
- Wafer Dicing
- Package Dicing
- Others (Glass, Ceramics)
Author
Ismail Sutaria (Lead Consultant, Packaging and Materials) has over 8 years of experience in market research and consulting in the packaging & materials industry. Ismail’s strength lies in identifying key challenges faced by the client and offering logical and actionable insights to equip the clients with strategic decision-making power.
Ismail has been an instrumental part of several transformational consulting assignments. His key skills include competitive benchmarking, opportunity assessment, macroeconomic analysis, and business transformation advisory. Ismail is an MBA holder in Marketing and has a Bachelor’s Degree in Mathematics.
Ismail is a regular at industry conferences and expos and has been widely covered in electronic and print media. He is a Speaker at our upcoming Talk show – Rise of the Intelligent Packaging. Ismail has been quoted in leading publications, including the European Pharmaceutical Review and the European Adhesive Tape Association.
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