The Panel Level Packaging (PLP) Market is a segment within the semiconductor packaging industry that revolves around innovative packaging techniques involving the use of larger substrate panels instead of traditional individual semiconductor wafers. Panel-level packaging is designed to address challenges related to scalability, cost-effectiveness, and efficiency in the production of semiconductor devices.
In 2023, it is expected that the global Panel Level Packaging Market will be worth US$ 2.1 billion. By 2033, the market is projected to be worth about US$ 8.5 billion. It is anticipated to increase at an astounding rate of 14.9% CAGR from 2023 to 2033.
Manufacturers are actively urging their suppliers to provide panel-processing equipment and materials, allowing them to achieve wafer-level precision in their packaging operations on panel substrates. The rise of panel level packaging (PLP) is poised to emerge as a pivotal and indispensable packaging technique.
Field-programmable gate arrays (FPGA), central processing units, graphics processing units, power management integrated circuit modules, basebands, and various other electronic components are harnessed through this packaging approach. This method not only enhances design flexibility but also serves to reduce the overall expenses associated with circuit packaging.
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Market Dynamics and Trends:
- 5G Technology: The rollout of 5G networks is driving demand for advanced semiconductor devices with increased processing power and high-speed data transfer capabilities. Panel-level packaging is well-suited for meeting the requirements of 5G applications.
- High-Performance Computing: The demand for high-performance computing solutions, including artificial intelligence (AI) and data centers, is fueling the adoption of panel-level packaging for its ability to support advanced packaging techniques and 3D integration.
- Consumer Electronics: The consumer electronics sector, including smartphones and wearable devices, benefits from the cost-effectiveness and scalability offered by panel-level packaging. It enables the production of compact and efficient devices.
- Automotive Electronics: The automotive industry’s increasing reliance on advanced electronics for vehicle functionalities, including connectivity and autonomous driving features, is driving the adoption of panel-level packaging for efficient and reliable semiconductor assembly.
- Environmental Considerations: Panel-level packaging contributes to environmental sustainability by optimizing manufacturing processes and reducing waste. The larger substrate size and increased throughput align with sustainability goals.
Key Takeaways from the Panel Level Packaging Market Study:
- From 2018 to 2022, the Panel Level Packaging Market showed a historical CAGR of about 6%, which was rather significant.
2. By 2033, it is anticipated that the Panel Level Packaging Market in the USA will be worth US$ 1.4 billion.
3. The Panel Level Packaging Market in the United Kingdom is projected to surge at a 2% CAGR during the forecast period.
4. During the assessment period, South Korea is expected to generate an absolute dollar opportunity of around US$ 392.7 million.
5. The fan-out panel level packaging category is anticipated to increase at a CAGR of 8% by 2033, according to integration type.
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Key Players
- Amkor Technology Inc.
- Deca Technologies
- Lam Research Corporation
- ASE Group
- Siliconware Precision Industries Co. Ltd.
- Fraunhofer Institute
- SPTS Technologies
- Stats ChipPac
- Qualcomm Technologies
- Samsung
- TSMC
For instance,
LB Semicon, an OSAT firm with its headquarters in South Korea, said in June 2022 that starting the following year, it will provide fan-out wafer level packaging solutions. This action aims to lessen the company’s reliance on the display driver integrated circuit dumping industry. The business provides testing services for application processors and complementary metal-oxide semiconductor image sensors.
The first electronic computer-aided design (ECAD) platform for 3D system design was released in October 2021 by a California-based company called Cadence. Building 3D stacked designs is anticipated to be done using the Cadence 3D-IC platform. This platform supports a variety of packaging arrangements, including 3D stacking, wafer-on-chip packaging, and fan-out wafer level packaging.
Samsung Electronics, a South Korea-based electronics maker, said in May 2021 that it would invest US$ 139.2 billion through 2030 on new manufacturing facilities, foundry operations, and system very large scale integration. The company’s foundry division will support cutting-edge technologies including high performance computing, 5G, and artificial intelligence.
Market Outlook by Category
By Integration Type:
- Fan-in Panel Level Packaging
- Fan-out Panel Level Packaging
By Carrier Type:
- 200 mm
- 300 mm
- Panel
By End User:
- Consumer Electronics
- IT and Telecommunication
- Industrial
- Aerospace and Defense
- Automotive
- Healthcare
- Others
By Region:
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East & Africa
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