The next generation packaging market is poised for significant growth, with projections indicating a market valuation of USD 12,847.9 million by 2023. Driven by rising demand and innovative advancements, the market is expected to expand at a robust compound annual growth rate (CAGR) of 6.43% from 2023 to 2033, ultimately reaching an impressive valuation of USD 23,952.9 million by 2033.
There are a number of important variables that will contribute to the next-generation packaging market’s expected large expansion globally. One of the main factors driving this trend is the growing need for packaging solutions with characteristics like easy-open mechanisms and legible labeling that are specifically designed to meet the needs of the aging global population.
With consumer preferences shifting toward packaged and easy foods, the retail industry in North America is enjoying rapid expansion. It is anticipated that this change would result in a significant demand for sophisticated packaging solutions in the area.
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In the midst of a significant expansion phase, the Asia Pacific food packaging industry is propelled by diverse factors. Increasing per capita income, a steadily growing population, and a rising demand for packaged food products are key drivers fueling this growth trajectory. Emerging economies like India, Japan, and China are at the forefront, steering the region’s increasing appetite for packaged food products.
The relentless pace of technological advancement is driving the production of small electronic devices across diverse industry verticals, ranging from consumer electronics and healthcare to automotive and semiconductor IC manufacturing. This trend is fueled by the growing demand for precise patterning on wafers and chips, leading to the relentless miniaturization of integrated circuits.
Notably, the medical devices sector has experienced a surge in the demand for Nano-sized robotic surgery equipment, driven by advancements in wearable technology and personalized healthcare devices. Consequently, designers are increasingly turning to smart packaging solutions as a means to accommodate these miniature electrical devices.
Within the semiconductor industry, the push for miniaturized electrical components is driven by the escalating need for high-performance electronics. Advanced semiconductor packaging techniques have emerged to meet these demands, but they come at a cost. Compared to conventional packaging methods, advanced packaging methods are more expensive. As the semiconductor manufacturing process progresses to each subsequent node, the costs rise significantly, reaching a point where it becomes economically challenging to continue development and production.
The intricacies of integrated circuits contribute to higher wafer production costs. As chips and integrated circuits become more complex, incorporating intricate designs and densely packed components, the cost of advanced packaging escalates even further. These complexities and associated costs pose challenges for widespread adoption, especially for smaller enterprises operating with limited budgets.
Key Takeaways from the next generation packaging market Study:
- The market valuation in 2022 was US$ 12,800.3
- Based on packaging type, active packaging is expected to dominate at a market share of 43.6% by 2033.
- Based on application, food & beverage will register at a market share of 41.5% by 2033.
- The next-generation packaging market size expanded at 2.76% CAGR between 2018 and 2022.
- Asia Pacific is estimated to register at a market share of 8.7% in 2023.
- North America experiences a projected value share of 19.3% in 2023.
Competitive Landscape:
The next generation packaging industry boasts a substantial array of market participants. Research and development play a pivotal role among these players, primarily focusing on the introduction of eco-friendly product lines as a core aspect of their manufacturing endeavors.
These players employ various expansion strategies, including collaborations, mergers and acquisitions, and diligent exploration of regulatory approvals to bolster their market presence.
The Major key players Are next generation packaging market :
- Amcor Limited
- WestRock Company
- Sonoco Products Company
- Sealed Air Corporation
- Stora Enso Oyj
- Bemis Company, Inc.
- MULTIVAC
- WS Packaging Group, Inc.
- Active Packaging Limited
- ULMA Packaging
- S. Coop
Some of the key developments:
- DuPont, offers the Tyvek 40L medical packaging, a new class of Tyvek for medical packaging applications that offers a practical solution for safeguarding portable, low-risk equipment, we thank DuPont Protection Solutions.
- Microchip Technology Inc. has unveiled the GridTime 3000 GNSS time server, a software-configurable system that protects power plants and substations from surges, bad weather, and cyber-attacks targeting critical infrastructure.
- Analog Devices, Inc., has unveiled a three-axis MEMS accelerometer that may be used in a variety of healthcare and industrial applications, such as vital sign monitoring, hearing aids, and motion-enabled metering devices. The ADXL367 accelerometer reduces power consumption by two times compared to the previous generation (ADXL362) while boosting noise performance by up to 30%.
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Key Segments Covered
Packaging Type:
- Active Packaging
- Antimicrobials
- Gas Scavengers
- Gas Emitters
- Others (Moisture & Corrosion Control)
- Intelligent Packaging
- Sensors
- Indicators
- Tags
- Modified Atmosphere Packaging
By Application:
- Food & Beverages
- Healthcare & Pharmaceuticals
- Personal Care
- Logistics & Supply Chain
- Others (Automotive & Industrial)
By Region:
- North America
- Latin America
- Western Europe
- Eastern Europe
- East Asia
- South Asia & Pacific
- The Middle East & Africa
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Future Market Insights, Inc. (ESOMAR certified, recipient of the Stevie Award, and a member of the Greater New York Chamber of Commerce) offers profound insights into the driving factors that are boosting demand in the market. FMI stands as the leading global provider of market intelligence, advisory services, consulting, and events for the Packaging, Food and Beverage, Consumer, Technology, Healthcare, Industrial, and Chemicals markets. With a vast team of over 400 analysts worldwide, FMI provides global, regional, and local expertise on diverse domains and industry trends across more than 110 countries.
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