The 3D ICs are advanced technology which supports in designing and developing latest consumer goods by decreasing the size of components used in these devices. In addition to this, they provide better speed, efficiency, memory, and durability to these upcoming devices. Resultantly, 3D ICs are gaining popularity in several industries, thereby leading to a drastic increase in demand globally.
Rising microelectronics & semiconductor landscape is creating a trend of integrated circuits (ICs) that are vertically stacked, which is becoming a profitable solution for increased functionality, providing elevated performance, and decreasing power consumption to meet the electronic device’s requirement.
These ICs are witnessing tremendous demand by the medical, aerospace, military and consumer electronics sector. This helps in fulfilling the requirements of integrating disparate technologies, which includes the memory, logic, RF, and sensors in small forms for industrial applications.
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The semiconductor industry is witnessing the emergence of 3D packaging trend using through-silicon vias (TSVs) technology. Emerging trend is driven by the need to reduce timing delays and enhancing the performance.
High aspect ratio, low cost, and formation & fillings technologies are necessary for today’s semiconductor industry. With an increase in functional integration requirements, water and assembly fabrication organizations are looking for 3D TSV technology.
Propagation of IoT-based devices and mounting awareness for energy efficient is triggering numerous manufacturing companies to innovate and improve their products by adopting 3D integrated products.
3D ICs Market: Driver & Restraint
Increase in Demand for Consumer Electronics Thrive Market Growth
Rise in demand for compact and high-performance ICs in computers, laptops, tablets, mobile phone and all other consumer electronic products is expected to increase the demand for 3D ICs.
These are among the major factors encouraging the growth of the market. Better performance and higher band width, which is a mandatory aspect in manufacturing of energy efficient devices such as 3D LEDs
Growing R&D investments coupled with strategic partnerships amid the market players is anticipated to increase the applications of these 3D ICs. For instance, in August 2020, Samsung Electronics launched silicon-proven 3D IC packaging technology- eXtended-Cube (X-Cube) for next-gen high performance applications such as artificial intelligence AI, 5G, virtual reality (VR), augmented reality (AR), and wearable devices.
The development leverages TSV technology that enables significant leaps in data transfer power and speed efficiency in order to meet the growing performance demand for advanced applications.
3D ICs Market: Competition Landscape
Examples of some of the market participants in the global 3D ICs market identified across the value chain include
- Toshiba Corporation
- Samsung Electronics Co. Ltd.
- Broadcom Ltd.
- ASE Group
- STMicroelectronics
- Taiwan Semiconductor Manufacturing Co. Ltd.
- United Microelectronics Corporation
- Intel Corporation
- Amkor Technology
- Xilinx Inc.
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The report covers exhaustive analysis on
- 3D ICs Market Segments
- 3D ICs Market Dynamics
- 3D ICs Market Size
- Supply & Demand
- Current Trends/Issues/Challenges
- Competition & Companies Involved in the Market
- Technology
- Value Chain of the Market
- Market Drivers and Restraints
Regional analysis includes
- North America (U.S., Canada)
- Latin America (Mexico, Brazil, Rest of LATAM)
- Europe (Germany, Italy, U.K, Spain, France, Nordic countries, BENELUX, Russia, Rest of Europe)
- East Asia (China, Japan, South Korea)
- South Asia and Pacific Excluding Japan (India, Malaysia, Indonesia, Singapore, Australia & New Zealand, Rest of South Asia and Pacific)
- Middle East and Africa (GCC Countries, Turkey, Northern Africa, South Africa, Rest of MEA)
3D ICs Market: Segmentation
The 3D ICs market can be segmented on the basis of product type, substrate type, application, industry verticals and region.
Product Type:
- 3D Stacked ICs
- True 3D ICs
Substrate Type:
- Silicon on insulator(SOI)
- Bulk silicon
Application:
- Memory
- LED
- MEMS
- Sensor
Industry Verticals:
- Automotive
- Consumer Electronics
- Healthcare
- Military & Defense
- IT & Telecommunication
- Others
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