The underfill dispenser market, with a current size of US$ 50 Bn in 2022, is anticipated to grow at a CAGR of 6% through 2032. By 2032, the market is anticipated to be worth US$ 100.61 Bn. Heavy R&D spending is straining a number of smaller companies, which might be detrimental to the sector as a whole. Nevertheless, it is anticipated that new items will be created when new rivals enter the underfill dispenser market.
This will definitely help the market flourish as a result. Players in the underfill dispenser market are working hard and investing in new jetting technologies in order to increase their sales. These new technologies have been developed to enhance performance in various areas, including dispensing precision.
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Underfill Dispenser Market: Key Players
Underfill dispenser manufacturers are tapping opportunities by targeting areas like micro mechanical device, 3D systems and many more.
Some of the key market players in the underfill dispenser market are
- Henkel (Loctite),
- Newport Corporation,
- Shenzhen Stihom Electronics Co. LTD,
- Zmation Inc.,
- Nordson Corporation,
- Zymet Inc,
- Master bond Inc.,
- Protec,
- Speedline Technologies,
- ITW Dynatec,
- sulzer and many others.
The research report presents a comprehensive assessment of the market and contains thoughtful insights, facts, historical data, and statistically supported and industry-validated market data. It also contains projections using a suitable set of assumptions and methodologies. The research report provides analysis and information according to market segments such as geography, technology and applications.
Factors boosting the demand for underfill dispensers and are likely to provide growth opportunities for the players:
- Underfill is used to increase dependability at the following phases of the manufacturing process.
- Underfill is used at the substrate, wafer, and panel levels in flip-chip, 2D, 2.5D, 3D, and other packaging designs. Wafer and panel-level applications continue to gain favor due to considerable cost savings.
- The chip-on-wafer (CoW) design lowers production costs by constantly lowering and growing the chip population on wafers, reducing the distance between chips to a few hundred microns. Simultaneously, bump heights beneath the chips are lowered to tens of microns for compact form factors.
- Despite the narrow geometries, huge amounts of underfill must be provided neatly between chips and flow underneath them to enclose solder bump connections.
Manufacturers are now able to fulfill particular industrial & consumer requirements, which has fueled product demand in numerous sectors, thanks to the emergence of highly modern technology that can manage fluid volumes & patterns. These factors are anticipated to present chances for underfill dispenser manufacturers to expand their market share.
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Dynamics of the Underfill Dispenser Market
The yield of the underfill process has increased recently as a result of the switch from the needle process to jetting technology in the dispensing process. The semiconductor sector has transformed the broader electronic industry in recent years thanks to technical advancement, and the underfill dispenser market has been expanding concurrently.
The need for the underfill dispenser market is expected to rise in the coming years due to the expanding applications of flip chips and the growing desire for smaller, less expensive, lighter electronic gadgets. Flip chip packaging offers key benefits to the semiconductor industry, including increased electrical performance and a lower integrated circuit footprint.
Underfill Dispenser Market: Segmentation
On the basis of product type, the global underfill dispenser market is segmented into,
- Capillary flow underfill (CUF)
- No flow underfill (NUF)
- Molded underfill (MUF)
On the basis of application, the global underfill dispenser market is segmented into,
- Flip chips
- Ball Grid array
- Chip Scale Packaging
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