The advanced packaging market is poised for substantial expansion, with a projected compound annual growth rate (CAGR) of 7.2% expected between 2023 and 2033. In 2023, the market is anticipated to reach a valuation of US$ 30.5 billion, and it is projected to surge to a remarkable US$ 61.3 billion by the year 2033. This robust growth trajectory underscores the increasing significance of advanced packaging technologies in meeting the demands of ever-evolving semiconductor and electronics markets.
Initially, the primary objective behind the development of the redistribution method was to facilitate fan-in area array packaging when only a limited number of chips were necessary for the array. Over time, this methodology has significantly contributed to the advancement of various innovative packaging technologies, including through-silicon via (TSV)-based interposers, wafer-level packaging, chip stacking, and fan-out packaging. These innovations have all greatly benefitted from the redistribution method, propelling the semiconductor packaging industry forward.
The integrated circuit packaging sector has been subject to a constant evolution of product attributes, integration techniques, and energy efficiency standards. This transformation can be largely attributed to the surging demand from a diverse array of industries within the semiconductor sector.
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Top Trends Pushing Sales of Advanced Packaging Worldwide
- Miniaturization of Electronics Devices to Augur Well by 2033
In contrast to conventional semiconductor packaging methods, advanced packaging is rapidly gaining widespread recognition on a global scale. The miniaturization of electronic devices plays a pivotal role in propelling the sales of advanced packaging solutions worldwide.
The extensive adoption of micro-electromechanical systems (MEMS) is poised to drive the demand for embedded die packaging solutions. While this technology is not novel, it has historically been confined to niche applications due to its high cost and limited yield. Nevertheless, its potential for significant growth in the forecast period is substantial. Investments in this technology are expected to increase, spurred by developments in Bluetooth and radio frequency modules, alongside the emergence of WiFi-6 technology. This convergence of factors is set to reshape the landscape of advanced packaging in the semiconductor industry.
Drivers:
- Increased Demand for Miniaturization: The demand for smaller, lighter, and more compact electronic devices is driving the need for advanced packaging technologies that can accommodate more functionality in a smaller footprint.
- Rising Need for Higher Performance: Advanced packaging allows for better thermal management and electrical performance, making it essential for high-performance applications like 5G, AI, and high-end computing.
- Consumer Electronics Boom: The proliferation of smartphones, wearables, and IoT devices has fueled the demand for advanced packaging solutions that offer improved power efficiency and compact form factors.
- Heterogeneous Integration: Advanced packaging enables the integration of diverse technologies, such as logic, memory, sensors, and power management, into a single package, enhancing the functionality of electronic systems.
- Energy Efficiency: Advanced packaging methods can improve energy efficiency in electronic devices, which is a crucial consideration in applications like electric vehicles and renewable energy systems.
- Environmental Concerns: Eco-friendly packaging solutions, such as 3D packaging and chip stacking, are gaining prominence due to their reduced environmental impact.
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Key Players:
- Amkor Technology Inc.
- ASE Technology Holding Co. Ltd.
- China Wafer Level CSP Co. Ltd.
- ChipMOS Technologies Inc.
- FlipChip International LLC
- HANA Micron Inc.
- Jiangsu Changjiang Electronics Technology Co. Ltd.
- King Yuan Electronics Corp.
- Nepes Corporation
- Powertech Technology Inc.
Advanced Packaging Market Outlook by Category
By Type:
- Flip Chip Scale Package
- Flip Chip Ball Grid Array
- Wafer Level Chip Scale Packaging
- 5D/3D
- Fan Out Wafer-level Packaging
- Others
By End User:
- Consumer Electronics
- Healthcare
- Industrial
- Aerospace and Defense
- Automotive
- Other
By Region:
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East & Africa
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About Future Market Insights (FMI)
Future Market Insights, Inc. (ESOMAR certified, recipient of the Stevie Award, and a member of the Greater New York Chamber of Commerce) offers profound insights into the driving factors that are boosting demand in the market. FMI stands as the leading global provider of market intelligence, advisory services, consulting, and events for the Packaging, Food and Beverage, Consumer Technology, Healthcare, Industrial, and Chemicals markets. With a vast team of over 5000 analysts worldwide, FMI provides global, regional, and local expertise on diverse domains and industry trends across more than 110 countries.
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