Advanced packaging refers to innovative packaging technologies and techniques that go beyond traditional methods to enhance performance, functionality, and efficiency in various industries. These advanced packaging solutions often incorporate cutting-edge materials, processes, and designs to address specific challenges and requirements.
The advanced packaging market is poised for substantial expansion, with a projected compound annual growth rate (CAGR) of 7.2% expected between 2023 and 2033. In 2023, the market is anticipated to reach a valuation of US$ 30.5 billion, and it is projected to surge to a remarkable US$ 61.3 billion by the year 2033. This robust growth trajectory underscores the increasing significance of advanced packaging technologies in meeting the demands of ever-evolving semiconductor and electronics markets.
The semiconductor sector has experienced a constant evolution in integrated circuit packaging, driven by substantial demand from diverse industries. This evolution encompasses ongoing changes in product attributes, integration capabilities, and energy efficiency measures.
The redistribution method initially aimed at facilitating fan-in area array packaging when a limited number of chips were needed for the array. Over time, this methodology has played a pivotal role in advancing various innovative packaging technologies, including through-silicon via (TSV)-based interposers, wafer-level packaging, chip stacks, and fan-out packaging.
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Top Trends
In contrast to conventional semiconductor packaging methods, advanced packaging is experiencing a surge in global popularity. The ongoing miniaturization of electronic devices is a key factor propelling the worldwide escalation in advanced packaging sales.
The substantial adoption of micro-electromechanical systems (MEMS) is anticipated to further drive the demand for embedded die packaging solutions. While this technology isn’t new, its application has historically been specialized for niche uses due to its high cost and limited yield. Nevertheless, the forecast period holds significant potential for growth, with increased investments likely, spurred by advancements in Bluetooth and radio frequency modules, along with the emergence of WiFi-6 technologies.
Drivers:
- Increased Demand for Miniaturization:The demand for smaller, lighter, and more compact electronic devices is driving the need for advanced packaging technologies that can accommodate more functionality in a smaller footprint.
- Rising Need for Higher Performance:Advanced packaging allows for better thermal management and electrical performance, making it essential for high-performance applications like 5G, AI, and high-end computing.
- Consumer Electronics Boom:The proliferation of smartphones, wearables, and IoT devices has fueled the demand for advanced packaging solutions that offer improved power efficiency and compact form factors.
- Energy Efficiency:Advanced packaging methods can improve energy efficiency in electronic devices, which is a crucial consideration in applications like electric vehicles and renewable energy systems.
- Environmental Concerns:Eco-friendly packaging solutions, such as 3D packaging and chip stacking, are gaining prominence due to their reduced environmental impact.
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Key Players:
- Amkor Technology Inc.
- ASE Technology Holding Co. Ltd.
- China Wafer Level CSP Co. Ltd.
- ChipMOS Technologies Inc.
- FlipChip International LLC
- HANA Micron Inc.
- Jiangsu Changjiang Electronics Technology Co. Ltd.
- King Yuan Electronics Corp.
- Nepes Corporation
- Powertech Technology Inc.
Few of the recent developments
- In October 2022, Amkor Technology declared their dedication to supporting initiatives in the Europe automotive sector. They are predicted to engage in enhanced semiconductor manufacturing in order to speed up the creation of technologies such as advanced driver assistance systems and infotainment for the automobile industry.
- In August 2022, Intel Corporation, a USA-based maker of integrated circuits, announced that the Meteor Lake, Arrow Lake, and Lunar Lake processors were produced by utilizing Foveros technology. The latest high-end graphics processing units 9GPUs) were built using embedded multi-die interconnect bridge (EMIB) and cutting-edge Foveros technology.
Advanced Packaging Market Outlook by Category
By Type:
- Flip Chip Scale Package
- Flip Chip Ball Grid Array
- Wafer Level Chip Scale Packaging
- 5D/3D
- Fan Out Wafer-level Packaging
- Others
By End User:
- Consumer Electronics
- Healthcare
- Industrial
- Aerospace and Defense
- Automotive
- Other
By Region:
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East & Africa
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Future Market Insights, Inc. (ESOMAR certified, recipient of the Stevie Award, and a member of the Greater New York Chamber of Commerce) offers profound insights into the driving factors that are boosting demand in the market. FMI stands as the leading global provider of market intelligence, advisory services, consulting, and events for the Packaging, Food and Beverage, Consumer Technology, Healthcare, Industrial, and Chemicals markets. With a vast team of over 5000 analysts worldwide, FMI provides global, regional, and local expertise on diverse domains and industry trends across more than 110 countries.
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