In 2023, the SRAM and ROM design IP market might be valued $23 million. By 2033, it is expected to have expanded at a compound annual growth rate (CAGR) of 3.5%, totaling $33.1 million. Greater processing speeds are propelling the SRAM and ROM design IP market forward, but other factors, including as SRAM’s scalability difficulty, may limit its progress.
The fast rise of data volume and the growing popularity of online content have pushed storage makers to constantly innovate. Microcontrollers, embedded systems, programmable devices, and application-specific integrated circuits are in great demand in industrial and scientific fields, as well as the automobile industry. Demand for electrical components in the consumer electronics industry is increasing.
Accelerating SRAM and ROM Design IP Market Growth with Faster Processing Speed
The SRAM and ROM design IP industry is witnessing remarkable growth propelled by the demand for faster processing speeds. The clock speed of a CPU plays a crucial role in determining the retrieval and interpretation of instructions, enabling computers to perform tasks swiftly. SRAM’s superiority over DRAM lies in its reduced need for refreshing, resulting in faster access times.
With access periods as low as ten nanoseconds, SRAM outperforms DRAM’s 60 nanoseconds. By serving as a processor cache, SRAM enhances system performance. The rising applications of SRAM, driven by the need for efficient data retrieval and processing, fuel the SRAM and ROM design IP market expansion.
The Struggle of SRAM Scaling for Design IP Industry
The scaling issue of SRAM is hindering the market growth of SRAM and ROM design IP. Two significant challenges associated with SRAM scaling are cell stability and physical area constraints. The minimum voltage required for SRAM (SRAM Vmin) depends on transistor Vt mismatch, which is affected by structural and random dopant fluctuation (RDF).
Vt mismatch is inversely proportional to the size of the device/cell, meaning larger cells are more stable. Unfortunately, the scaling of SRAM cell size is restricted by critical ground rules, posing difficulties in terms of physical area. Chipmakers must make tough processes and design choices to overcome these challenges. Consequently, these obstacles may harm the market growth for SRAM and ROM design IP in the forecast period.
Key Takeaways
- From 2023 to 2033, the SRAM sector in the type category of the SRAM and ROM design IP market is expected to see a CAGR of 3.5%.
- Market growth for SRAM and ROM design IP in North America may average 3.3% CAGR from 2023 to 2033.
- During the anticipated period, the SRAM and ROM design IP industry in the United States is expected to grow at a CAGR of 2.6%.
- Between 2023 and 2033, the SRAM and ROM design IP business in the United States can reach US$ 10.4 million.
- From 2023 to 2033, the United Kingdom SRAM and ROM design IP market may grow to US$ 1.5 million.
- Market in the United Kingdom is anticipated to grow at a 2.9% CAGR over the forecast period.
- China’s SRAM and ROM design IP industry is anticipated to grow at a 4.7% CAGR between 2023 and 2033.
- By 2033, the China SRAM and ROM design IP market to be worth US$ 2.8 million.
- Market growth in Japan is anticipated to average 3.2% CAGR throughout the forecast period.
- Between 2023 and 2033, the Japan SRAM and ROM design IP business may reach US$ 2.4 million.
- Between 2023 and 2033, the South Korean SRAM and ROM design IP industry to reach US$ 1.3 million.
- SRAM and ROM design IP business in South Korea is anticipated to grow at a CAGR of 4.1% during the next years.
Competitive Landscape
Moderate market fragmentation exists for SRAM and ROM Design IP globally. The SRAM and ROM design IP manufacturers are advancing their product lines with the most recent technological trends and advancements. To enhance their market share, they concentrate on strategic alliances.
Recent Innovations
- Mentor Graphics and TSMC Collaborate for Enhanced IC Design and Advanced Packaging Solutions
The industry-leading N5 and N6 process technologies from TSMC were certified by Mentor Graphics Corporation in May 2020. This follows the company’s announcement that it had obtained certification for a wide range of Mentor integrated circuit (IC) design tools. Utilizing Mentor’s Caliber platform 3DSTACK packaging technology to enable TSMC’s advanced packaging platforms, the partnership between Mentor and TSMC has expanded to include advanced packaging technologies.
- Everspin and GLOBALFOUNDRIES Extend Joint Development Agreement for Next-Gen MRAM Solution
The spin-transfer torque (STT-MRAM) joint development agreement (JDA) between Everspin Technologies Inc. and the specialized foundry GLOBALFOUNDRIES (GF) was modified in March 2020. On the development and production of STT-MRAM using technologies of 40 nm, 28 nm, and 22 nm, Everspin, and GF collaborated. They revised their agreement to establish the terms of a future project using an advanced 12-nm FinFET MRAM technology.
Key Segments
By Type:
- SRAM
- ROM
By Region:
- North America
- Latin America
- Europe
- Asia Pacific
- Middle East and Africa
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