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The BGA market is driven rapidly due to its low cost, denser type of packing and also higher performance. The increasing demand for diverse and smaller size packaging from electronic OEM’s drives the global BGA market. Also, increasing semiconductor and IC chip industry drives the global BGA market.
However, the challenges in designing of BGA are critical which might restrain the global BGA market.
The global BGA market is geographically divided into five key regions including North America, Latin America, Europe, Asia-Pacific (APAC) and the Middle East & Africa (MEA).Asia Pacific, especially China, Taiwan, Hong Kong, Japan contributes majorly to the BGA market. The semiconductor industry in Asian countries has the strong foothold, thus it is expected that BGA market will show strong growth during the forecast period. Followed by APAC are North America, Europe, Latin America and MEA.
Ball Grid Array (BGA) Packaging Market – Major Players:
Some of the key players identified in the global BGA packaging market are Amkor Technology, TriQuint Semiconductor Inc., Jiangsu Changjiang Electronics Technology Co. STATS ChipPAC Ltd., ASE Group, Advanced Semiconductor Engineering, Inc., PARPRO, etc.
The research report presents a comprehensive assessment of the market and contains thoughtful insights, facts, historical data, and statistically supported and industry-validated market data. It also contains projections done using a suitable set of assumptions and methodologies. The research report provides analysis and information according to categories such as market segments, geographies, type, machine size and end use.
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The report covers exhaustive analysis on:
- Market Segments
- Market Dynamics
- Market Size
- Supply & Demand
- Current Trends/Issues/Challenges
- Competition & Companies involved
- Value Chain
Regional analysis includes
- North America
- Latin America
- Asia Pacific
- Middle East and Africa
The report is a compilation of first-hand information, qualitative and quantitative assessment by industry analysts, inputs from industry experts and industry participants across the value chain. The report provides an in-depth analysis of parent market trends, macro-economic indicators, and governing factors, along with market attractiveness as per segments. The report also maps the qualitative impact of various factors on market segments and geographies.
Ball Grid Array Bga Packaging Market
The global BGA market is segmented on the basis material type and BGA type.
Based on the material type of BGA, global BGA market is segmented into:
- Ceramic/ (CBGA)
- Plastic/ (PBGA)
- Tape/ (TBGA)
Based on the type of BGA, global BGA market is segmented into:
- Molded Array Process BGA
- Thermally Enhanced BGA
- Package on Package (PoP) BGA
- Micro BGA
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- Detailed overview of parent market
- Changing market dynamics in the industry
- In-depth market segmentation
- Historical, current and projected market size in terms of volume and value
- Recent industry trends and developments
- Competitive landscape
- Strategies of key players and products offered
- Potential and niche segments, geographical regions exhibiting promising growth
- A neutral perspective on market performance
- Must-have information for market players to sustain and enhance their market footprint