The global market for moulded underfill material is anticipated to reach US$ 8 billion in 2022 and grow at a CAGR of 5% through 2032. By the conclusion of the 2022–2032 assessment period, the market demand for moulded underfill material is anticipated to be worth US$ 13.03 billion.
Due to its multifunctional products, the semiconductor industry is gaining traction across several end user sectors. As a result, the crucial packaging needed for semiconductor products was developed. As a result, moulded underfill materials are widely employed for semiconductor product packaging.
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Moreover, the use of moulded underfill materials is rising as electrical device penetration continues. Over time, as packaging has evolved into a necessary element, so has reliance on it.
Due to their great reliability and low cost, moulded underfill materials are employed in a variety of electrical applications. Moreover, the development of flip chips is encouraging the usage of moulded underfill materials. Electrical applications’ sizes are evolving dramatically.
As a result, packaging has become more inventive, and the way that moulded underfill materials are used has changed. The market for semiconductors and electrical appliances is greatly benefited by the use of moulded underfilled materials since electrical applications demand specialised packaging.
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Molded Underfill Material Market: Few Players
Few players identified in molded underfill material market are:-
- Henkel
- Won Chemicals Co. Ltd.
- Epoxy Technology Inc.
- AIM solder
- Namics Corporation
- Others
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Molded Underfill Material Market: Market Segmentation
The molded underfill material market is segmented into three parts based on technology types, application types, and geography.
Based on the technology type application molded underfill material market is segmented into:
- Differential Scanning Calorimeter (DSC)
- Thermo-gravimetrical Analyzer (TGA)
- Thermal Mechanical Analyzer (TMA)
- Coefficient of Thermal Expansion (CTE)
- Dynamic Mechanic Analyzer (DMA)
- Others
Based on the application molded underfill material market is segmented into:
- Flip chips
- Ball grid array (BGA)
- Chip scale packaging (CSP)
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